PTIS Principal Brian Wagner spoke with Packaging Digest about the 4th dimension of packaging – which brings the element of digital transformation, and Internet of Things (IoT) or Internet of Packaging (IoP) where the physical and digital worlds collide. To read the full article click here
Packaging design opportunities abound in the 4th Dimension
by todd bukowski | Feb 20, 2018 | Industry News, Partner News, Recent Articles | 0 comments